Yesterday we heard all sorts of info claimed to be the specs of the new Samsung Galaxy S6, along with several sources such as Bloomberg saying that Samsung were dropping the Qualcomm Snap Dragon 810 mobile chip due to overheating issues. Instead choosing to use their own Exynos chip to power all versions of the device. However LG have come out with conflicting information about the new chip.
In stark contrast to the reports from Bloomberg, LG say there is no overheating issue with Qualcomm’s Snapdragon 810. Woo Ram-chan, LG Vice President for Mobile Product Planning spoke to the press at an event yesterday for their new G Flex 2. He attempted to calm rumors of the chip’s demise, as they chose it to power its curved screen flagship over many others on the market.
“I am very much aware of the various concerns in the market about the (Snapdragon) 810, but the chip’s performance is quite satisfactory,” Woo Ram-chan, LG vice president for mobile product planning
No Smoke Without..
Woo went onto throw some more fuel to the fire, saying that in fact, during internal LG testing, the new Qualcomm chip emitted less heat than other existing devices – which could be interpreted as a swipe at Samsung to say the engineering at LG is better. Bloomberg believes that Samsung dropped the chip after their own internal testing revealed the 810 was overheating during stress testing and found to be unreliable.
Samsung declined to comment to such claims so it may be that all of these rumors are unfounded, however we won’t have long to wait as Samsung will be announcing the new Galaxy flagship at or around MWC on 2nd – 5th March, and will launch soon after. While LG’s G Flex 2 hits stores around January 30th, so if they suddenly start bursting into flames we can blame Qualcomm.
How will the new Galaxy S6 fair against new flagships form HTC, LG and others? Let us know which you will be buying in the comments below or on social media.Source: Financial Express