Qualcomm announces three new Snapdragon chipsets in Hong Kong

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Yesterday at the 4G/5G Summit in Hong Kong, Qualcomm unveiled three new Snapdragon chipsets for the 600 and 400 series for mid range devices such as smartphones and tablets. All three chips, the Snapdragon 653, 626, and 427, are set to provide higher processing power than their predecessors. They will support Qualcomm Quick Charge 3.0 that will deliver charging power 4x faster than traditional charging methods. There will be support for dual cameras just like the 800 series has, so even mid range devices will be able to provide crisp photos with any type of scene.

Each SoC will offer the same modem capabilities:

  • X9 LTE, with Cat 7 downlink speeds up to 300Mbps, and Cat 13 uplink speeds up to 150Mbps, designed to provide users with a 50 percent increase in maximum uplink speeds over the X8 LTE modem.
  • LTE Advanced Carrier Aggregation with up to 2×20 MHz in the downlink and uplink
  • Support for 64-QAM in the uplink
  • Superior call clarity and higher call reliability with the Enhanced Voice Services (EVS) codec on VoLTE calls.

Features of the Snapdragon 653:

  • An increase in CPU/GPU compared to the 652, but has a jump from 4GB of RAM to 8GB of RAM.

Features of the Snapdragon 626:

  • An increase of CPU from the 625, but also includes Qualcomm TruSignal antenna boost which provide more signal in congested areas.

Features of the Snapdragon 427:

  • An increase in CPU/GPU from the 425. This will also be the first 400 series SoC to support TruSignal.

Senior vice president of product management, Alex Katouzian had this to say in Hong Kong.

It has always been Qualcomm Technologies’ strategy to introduce industry-leading features first at the premium Snapdragon 800 tier design point, and then scale these features into our other Snapdragon products. A great example of this strategy is the use of dual camera for capturing high quality photos that now range across our portfolio, including our 400 series mobile solution. Doing this allows our customers and smartphone developers to reach a broad subscriber base with advanced features and great end-user experiences.

The Snapdragon 652 and 626 are set to be in devices by the end of this year while the Snapdragon 427 will be in devices in early 2017.

So, with these new Snapdragon SoC, do you think we will see a few more manufacturers implementing dual cameras in their phones to match the abilities that the chipsets have to offer? Also, what are your thoughts about Qualcomm’s new Snapdragon SoC? Let us know by leaving your comments down below, or on Google+, Facebook, or Twitter.

[button link=”https://www.qualcomm.com/news/releases/2016/10/17/qualcomm-announces-introduction-new-snapdragon-600-and-400-tier-processors” icon=”fa-external-link” side=”left” target=”blank” color=”285b5e” textcolor=”ffffff”]Source: Qualcomm[/button]
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