Gaming headsets primarily tend to be of the traditional closed-back style. Sennheiser has expanded their open acoustic lineup of gaming headsets with the GSP 500. Not only do open headsets offer arguably better sound, they also offer better comfort and more airflow for longer listening sessions.
“As with every Sennheiser gaming headset, the GSP 500 has been designed from the ground up to enhance every aspect of the gaming experience and let you perform at your very best,” said Andreas Jessen, Head of Product Management Gaming, Sennheiser Communications A/S. “As well as delivering superior audio and comfort, a fully immersive gaming experience also depends on effortless ease of use and communication – even in the midst of fast-paced action.”
The GSP 500 follows up on some of Sennheiser’s previously open headsets like the G4ME ONE and feature a new, improved open speaker system design. This new design balances clarity with low-frequency response and delivers a more natural sound performance. In addition, Sennheiser has added some new features and enhancements to the headset for more comfortable extended gaming sessions. the 2-axis metal hinge allows for more freedom of movement and improved fit with an “innovative adjustable contact pressure mechanism” integrated into the headband.
The ear pads are more ergonomically shaped with a soft fabric that aims to be more pleasant and cooler feeling. With their open-backed design, they also provide more ventilation to minimize sweaty and clammy ears over extended gaming sessions.
The GSP 500 features a noise cancelling microphone which can be easily muted by lifting the boom mic. Volume adjustment is just as easy with integrated volume controls on the ear cup.
The Sennheiser GSP 500 open acoustic gaming headset is now available with an MSRP of $229.99USD and has a two-year warranty.
What do you think about the Sennheiser GSP 500 open acoustic gaming headset? Have you tried an open acoustic headset before? Let us know in the comments below or on Google+, Twitter, or Facebook.
